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- ㆍName : 이선병
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- ㆍCareer :
Korea Electric Terminal Co., Ltd.
M.S. Mechanical Engineering, Chung-Ang University, 2009
B.S. Mechanical Engineering, Chung-Ang University, 2007 - ㆍThesis :
Numerical investigation for flip chip underfill process and thermosonic chip-on-glass bonding with anisotropic conductive film (M.S. degree, 2009)
- ㆍName : 임병승
- ㆍEmail :
- ㆍCareer :
Kangwon National University
Chung-Ang University
Ph.D. Mechanical Engineering, Chung-Ang University, 2013
B.S. Mechanical Engineering, Chung-Ang University, 2008 - ㆍThesis :
A study on interconnection properties of carbon nanotube-filled solderable electrically conductive adhesives (ECAs) (Ph.D. degree, 2013)
- ㆍName : 전성호
- ㆍEmail :
- ㆍCareer :
Amkor Technology Korea
M.S. Mechanical Engineering, Chung-Ang University, 2010
B.S. Mechanical Engineering, Chung-Ang University, 2008 - ㆍThesis :
A Study on thermosonic ACF bonding processes (M.S. degree, 2010)
- ㆍName : 정현석
- ㆍEmail :
- ㆍCareer :
LG Innotek Co., Ltd
M.S. Mechanical Engineering, Chung-Ang University, 2010
B.S. Mechanical Engineering, Chung-Ang University, 2008 - ㆍThesis :
Structural characteristics of the microstructure using finite element analysis (M.S. degree, 2010)
- ㆍName : 여지훈
- ㆍEmail :
- ㆍCareer :
DAEWOO Engineering & Construction Co., Ltd.
M.S. Mechanical Engineering, Chung-Ang University, 2011
B.S. Mechanical Engineering, Chung-Ang University, 2009 - ㆍThesis :
Study on wettabilities of micro/nano structured polymer surfaces & development of robust hydrophobic surfaces (M.S. degree, 2011)
- ㆍName : 송용
- ㆍEmail :
- ㆍCareer :
Amkor Technology Korea
M.S. Mechanical Engineering, Chung-Ang University, 2011
B.S. Mechanical Engineering, Chung-Ang University, 2008 - ㆍThesis :
A study on ACF (Anisotropic Conductive Film) COB (Chip-on-Board) thermosonic bonding (M.S. degree, 2011)
- ㆍName : 오승훈
- ㆍEmail :
- ㆍCareer :
SEMES
Ph.D. Mechanical Engineering, Chung-Ang University, 2017
M.S. Mechanical Engineering, Chung-Ang University, 2012
B.S. Mechanical Engineering, Chung-Ang University, 2010 - ㆍThesis :
Numerical study on novel capacitive micromachined ultrasonic transducers (cmuts) with post structure (M.S. degree, 2012)
A Study on nanobubble generation and its applications (Ph.D. degree, 2017)
- ㆍName : 정진식
- ㆍEmail :
- ㆍCareer :
GM Korea Company
M.S. Mechanical Engineering, Chung-Ang University, 2012
B.S. Mechanical Engineering, Chung-Ang University, 2010 - ㆍThesis :
Characteristic study on thermosonic anisotropic conductive film (ACF) bonding for chip on film (COF) packaging (M.S. degree, 2012)
- ㆍName : 송호진
- ㆍEmail :
- ㆍCareer :
Hyundai motor company
M.S. Mechanical Engineering, Chung-Ang University, 2014
B.S. Mechanical Engineering, Chung-Ang University, 2012 - ㆍThesis :
A study on the stability and physical properties of micro- and nano-bubbles (M.S. degree, 2014)
- ㆍName : 이병훈
- ㆍEmail :
- ㆍCareer :
LG Chem Co., Ltd.
M.S. Mechanical Engineering, Chung-Ang University, 2015
B.S. Mechanical Engineering, Chung-Ang University, 2013 - ㆍThesis :
A study on the physical properties of underfill for improvement of bonding characteristics in BGA assembly (M.S. degree, 2015)
- ㆍName : 김경태
- ㆍEmail :
- ㆍCareer :
Hyundai Electric & Energy System Co., Ltd.
M.S. Mechanical Engineering, Chung-Ang University, 2016
B.S. Mechanical Engineering, Chung-Ang University, 2014 - ㆍThesis :
A study on no-flow underfill BGA bonding process using solderable electrically conductive adhesives (ECAs) (M.S. degree, 2016)
- ㆍName : 윤무성
- ㆍEmail :
- ㆍCareer :
Chungho Nais Co., Ltd
M.S. Mechanical Engineering, Chung-Ang University, 2016
B.S. Mechatronics Engineering, Chosun University, 2014 - ㆍThesis :
A study on the generation and stability of nano-bubbles using cavitation (M.S. degree, 2016)
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