Nam-Ho Kim, Jong-Min Kim, Oussama Khatib and Dongjun Shin,
Design optimization of hybrid actuation combining macro-mini actuators
International Journal of Precision Engineering and Manufacturing, V.18, N.04, pp.519-527, 2017

Byung-Seung Yim, Young-Eui Shin and Jong-Min Kim,
Influence of multi-walled carbon nanotube (MWCNT) concentration on the thermo-mechanical reliability properties of solderable anisotropic conductive adhesives (SACAs)
Microelectronics Reliability , V.91, N.02, pp.201-212, 2018

Byung-Seung Yim, Jeong Il Lee and Jong-Min Kim,
Influence of reductant concentration on the conduction path formation properties of solderable polymer composites,

Byung-Seung Yim, Young-Eui Shin and Jong-Min Kim,

BGA interconnection properties of solderable polymer composites with low-melting-point alloy fillers,

Journal of Electronic Packaging, V.139, N.04, pp.041007, 2017

Seung Hoon Oh and Jong-Min Kim,

Generation and stability of bulk nanobubbles,

LANGMUIR,V.33, N.15, pp.3818-3823, 2017

Byung-Seung Yim and Jong-Min Kim,

Effect of multi-walled carbon nanotube (MWCNT) concentration on thermomechanical reliability of MWCNT-reinforced solderable isotropic polymer nanocomposites,

Journal of Materials Science: Materials in Electronics, V.27, N.09, pp.9159-9171, 2016

Jeong Il Lee, Byung-Seung Yim, Dongjun Shin and Jong-Min Kim,

Three-dimensional multi-layer through-hole filling properties of solderable polymer composites with low-melting-point alloy filler,

Journal of Materials Science: Materials in Electronics, V.27, N.06, pp.6223-6231, 2016

Byung-Seung Yim, Kiho Kim, Jooheon Kim and Jong-Min Kim,

Influence of fuctionalized graphene on the electrical, mechanical, and thermal properties of solderable isotropic conductive adhesives,

Journal of Materials Science: Materials in Electronics, V.27, N.05, pp.4516-4525, 2016

Byung-Seung Yim and Jong-Min Kim,

Thermo-mechanical reliability of a multi-walled carbon nanotube-incorporated solderable isotropic conductive adhesive,

Microelectronics Reliability, V.57, pp.93-100, 2016

Jeong Il Lee, Byung-Seung Yim, Mu Seong Yun and Jong-Min Kim,

Through-hole filling characteristics of solderable polymer composites with low melting point alloy fillers,

Journal of Materials Science: Materials in Electronics, V.27, N.01, pp.982-991, 2016

Kiho Kim, Mihyun Kim, Jong-Min Kim and Jooheon Kim,

Magnetic filler alignment of paramagnetic Fe₃O₄ coated SiC/epoxy composite for thermal conductivity improvement,

Ceramics International, V.41, pp.12280-12287, Nov. 2015

Seung Hoon Oh, Jung Guen Han and Jong-Min Kim,

Long-term stability of hydrogen nanobubble fuel,

Fuel, V.158, pp.399-404, 2015

Byung-Seung Yim, Jeong Il Lee, Byung Hun Lee, Yong-Eui Shin and Jong-Min Kim,

Bonding characteristics of underfilled ball grid array packaging,

Materials Transactions, V.56, N.7, pp.974-980, 2015

Byung-Seung Yim and Jong-Min Kim,

Influence of multi-walled carbon nanotube (MWNT) concentration on the interconnection properties of solderable anisotropic conductive adhesives (SACAs),

Journal of Materials Science: Materials in Electronics, V.26, N.7, pp.4969-4980, 2015

Byung-Seung Yim and Jong-Min Kim,

Electrical and mechanical properties of multiwalled carbon nanotubes-reinforced solderable polymer nanocomposites,

Journal of Materials Science: Materials in Electronics, V.26, N.3, pp.1678-1689, 2015

Byung-Seung Yim, Byung Hun Lee, Jooheon Kim and Jong-Min Kim,

Effect of dispersion condition of multi-walled carbon nanotube (MWNT) on bonding properties of solderable isotropic conductive adhesives (ICAs),

Journal of Materials Science: Materials in Electronics, V.25, N.12, pp.5208-5217, 2014

Byung-Seung Yim, Jeong Il Lee, Byung Hun Lee, Young-Eui Shin and Jong-Min Kim,

An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler,

Microelectronics Reliability, V.54, N.12, pp.2944-2950, 2014

Hyuk Rok Gwon, Suk Tai Chang, Jung Yeul Jeong, Jong-Min Kim, Chang Kyoung Choi and Seong Hyuk Lee,

Development of a new contactless dielectrophoresis system for active particle manipulation using movable liquid electrodes,

Electrophoresis, V.35, N14, pp.2014-2021, 2014

Hyuk Rok Gwon, Hyung Jun Lee, Jong-Min Kim, Young Eui Shin and Seong Hyuk Lee,

Dynamic behavior of capillary-driven encapsulation flow characteristics for different injection types in flip chip packaging,

Journal of Mechanical Science and Technology, V.28, N.1, pp.167-173, 2014

Seung Hoon Oh, Seung Hyun Yoon, Hojin Song, Jung Guen Han and Jong-Min Kim,

Effect of hydrogen nanobubble addition on combustion characteristics of gasoline engine,

Int. Hydrogen Energy, V.38, N.34, pp.14849-14853, 2013

Byung-Seung Yim, Seung Hoon Oh, Jin Sik Jeong and Jong-Min Kim,

Self-interconnection characteristics of hybrid composite with low-melting-point alloy fillers,

Journal of Composite Materials, V.47, N.9, pp.1141-1152, 2013

Jin Sik Jeong, Byung-Seung Yim, Seung Hoon Oh, Hojin Song, Byung Hun Lee and Jong-Min Kim,

Properties investigation on chip-on-film (COF) thermosonic bonding using anisotropic conductive films (ACFs),

Materials Transactions, V.53, N.12, pp.2097-2103, 2012

Byung-Seung Yim, Jeong Il Lee, Yuseon Heo, Jooheon Kim, Seong Hyuk Lee, Yong-Eui Shin and Jong-Min Kim,

Reliability properties of solderable conductive adhesives with low-melting-point alloy fillers,

Materials Transactions, V.53, N.12, pp.2104-2110, 2012

Byung-Seung Yim, Yumi Kwon, Seung Hoon Oh, Jooheon Kim, Yong-Eui Shin, Seong Hyuk Lee and Jong-Min Kim,

Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging,

Microelectronics Reliability, V.52, N.6, pp.1165-1173, 2012

Byung-Seung Yim, Seung Hoon Oh, Jiwon Kim, Jooheon Kim and Jong-Min Kim,

Characteristics of graphene-filled solderable isotropically conductive adhesive (ICA),

Materials Transactions, V.53, N.3, pp.578-581, 2012

Jiwon Kim, Byung-Seung Yim, Jong-Min Kim and Jooheon Kim,

The effects of functionalized graphene nanosheets on the thermal and mechanical properties of epoxy composites for anisotropic conductive adhesives (ACAs),

Microelectronics Reliability, V.52, N.3, pp.595-602, 2012

Jiwon Kim, Hyungu Im, Jong-Min Kim and Jooheon Kim,

Thermal and electrical conductivity of Al(OH)₃ covered graphene oxide nanosheet/epoxy composites,

Journal of Materials Science, Vol.47, No.3, pp.1418-1426, 2012

Seong Hyuk Lee, Hyung Jun Lee, Jong-Min Kim and Young-Eui Shin,

Dynamic filling characteristics of a capillary driven underfill process in flip-chip packaging,

Materials Transactions, V.52, N.10, pp.1998-2003, 2011

Jen-Yung Chang, Bryan Plunger, Jong-Min Kim and Chang Kyoung Choi,

Biological temperature sensing of focal contacts,

Journal of Heat Transfer, V.133, N.8, pp.080907-1, Aug. 2011

Dong Hwan Shin, Jae Bin Lee, Jae Lyong Wi, Seungil Park, Namil, Kim, Minhaeng Cho, Jong Min Kim and Seong Hyuk Lee,

Flattening characteristics of Ni₂₀Cr thermal-sprayed coating layers on preheated SCM415 substrates,

Materials Transactions, V.52, N.7, pp.1515-1521, July 2011

Yumi Kwon, Byung-Seung Yim, Jong-Min Kim and Jooheon Kim,

Mechanical and wetting properties of epoxy resins: Amine-containing epoxy-terminated siloxane oligomer with or without reductant,

Microelectronics Reliability, V.51, N.4, pp.819-825, 2011

Yumi Kwon, Byung-Seung Yim, Jong-Min Kim and Jooheon Kim,

Dispersion, hybrid interconnection and heat dissipation properties of functionalized carbon nanotubes in epoxy composites for electrically conductive adhesives (ECAs),

Microelectronics Reliability, V.51, N.4, pp.812-818, 2011

Byung-Seung Yim and Jong-Min Kim,

Characteristics of isotropically conductive adhesive (ICA) filled with carbon nanotubes (CNTs) and low-melting-point alloy fillers,

Materials Transactions, V.51, N.12, pp.2329-2331, Dec. 2010

Jong-Min Kim, Yong Song, Minhaeng Cho, Seong Hyuk Lee and Young-Eui Shin,

Characteristics of thermosonic anisotropic conductive adhesives (ACFs) flip-chip bonding,

Materials Transactions, V.51, N.10, pp.1790-1795, Oct. 2010

Ji-Won Baek, Keon-Soo Jang, Yong-Sung Eom, Jong-Tae Moon, Jong-Min Kim and Jae-Do Nam,

Chemo-rheological characteristics of a self-assembling anisotropic conductive adhesive system containing a low-melting point solder,

Microelectronic Engineering, V.87, N.10, pp.1968-1972, 2010

Jung-Lae Jo, Jong-Bum Lee, Jong-Min Kim, Young-Eui Shin and Seung-Boo Jung,

Reliability of fine-pitch flip-chip (COG) bonding with non-conductive film using ultrasonic energy,

The Journal of Adhesion, V.86, N.5, 470-479, 2010

Hyomi Kim, Jong-Min Kim, Jooheon Kim,

Effects of novel carboxylic acid-based reductants on the wetting characteristics of anisotropic conductive adhesive with low melting point alloy filler,

Microelectronics Reliability, V.50, N.2, pp.258-265, 2010

Byung-Seung Yim, Jong-Min Kim, Sung-Ho Jeon, Seong Hyuk Lee, Jooheon Kim, Jung-Geun Han and Minhaeng Cho,

Hybrid interconnection process using solderable ICAs (Isotropic conductive adhesives) with low-melting-point alloy fillers,

Materials Transactions, V.50, N.11, pp.2649-2655, Nov. 2009

Taeyoung Kim, Joonho Lee, Yunkyum Kim, Jong-Min Kim and Zhangfu Yuan,

Investigation of the dynamic reactive wetting of Sn-Ag-Cu solder alloys on Ni(P)/Au coated Cu substrates,

Materials Transactions, V.50, N.11, pp.2695-2698, Nov. 2009

Jung-Lae Jo, Jong-Bum Lee, Jong-Gun Lee, Sung-Ho Jeon, Jong-Min Kim, Young-Eui Shin, Jeong-Hoon Moon, Choong-Don Yoo and Seung-Boo Jung,

Effect of surface treatment on the mechanical strength of ultrasonically bonded chip on copper-coated glass for ultra-fine pitch application in microelectronics,

Japanese Journal of Applied Physics, V.48, N.7, pp.07GA07-1-07GA07-4 , July 2009

Hyomi Kim, Jong-Min Kim, Jung-Geun Han and Jooheon Kim,

Curing kinetics and mechanical properties for siloxane contained ETSO-DDM/BPH epoxy system,

Polymer(Korea), V.33, N.4, pp.364-370, July 2009

Jae Hyung Kim, Jung Hee Lee, Jong-Min Kim and Seong Hyuk Lee,

Numerical analysis of coalescence characteristics of low melting point alloy fillers using non-equilibrium phase field model,

Materials Transactions, V.50, N.7, pp.1678-1683 , July 2009

Byung-Seung Yim, Jong-Min Kim, Sung-Ho Jeon, Seong Hyuk Lee, Jooheon Kim, Jung-Geun Han, Yong-Sung Eom and Young-Eui Shin,

Self-organized interconnection process using solderable ACA (Anisotropic conductive adhesive),

Materials Transactions, V.50, N.7, pp.1684-1689 , July 2009

Jung-Lae Jo, Ja-Myeong Koo, Jong-Bum Lee, Jong-Gun Lee, Seung-Boo Jung, Sung-Ho Jeon, Jong-Min Kim and Jeong-Hoon Moon,

Effect of atmospheric-pressure plasma treatment on the joint strength between Au flip chip bumps and Cu-finished Si wafer substrates bonded using ultrasonic energy,

J. Kor. Phys. Soc., V.54, N. 3, pp.1334-1338, Mar. 2009

Kyoung Chun Yang, Seong Hyuk Lee, Jong-Min Kim, Young Ki Choi, Dave F. Farson and Young-Eui Shin,

Characteristics of Sn-2.5Ag flip chip solder joints under thermal shock test conditions,

Journal of Mechanical Science and Technology, V.23, pp.435-441, Feb. 2009

Jin Woon Lee, Seong Hyuk Lee, Jong-Min Kim, Jae Hyung Kim and Jung Hee Lee,

Numerical investigation on self-organized interconnection using anisotropic conductive adhesive with low melting point alloy filler,

Materials Transactions, V.49, N.11, pp.2572-2578, Nov. 2008

Yong-Sung Eom, Keonsoo Jang, Jong-Tae Moon, Jae-Do Nam and Jong-Min Kim,

Electrical and mechanical characterization of an anisotropic conductive adhesive with a low melting point solder,

Microelectronic Engineering, V.85, N.11, pp.2202-2206, Nov. 2008

Kyong Ho Chang, H. C. Park, Chin Hyung Lee, Gab Chul Jang, Sang Hyong Lee, E. H. Choi, Young-Eui Shin, Jong-Min Kim and J. H. Lee,

Weldability studies on the replacement repair welded joints of a damaged steel bridge,

Materials Science Forum, V.580-582, pp.655-658, June 2008

J. G. Han, Kyong Ho Chang, Gab Chul Jang, Jong-Min Kim and Young-Eui Shin,

Development of visual monitoring system for deformation measuring of welded members and its application,

Materials Science Forum, V.580-582, pp.557-560, June 2008

S. W. Han, Kyong Ho Chang, J. G. Han, Il Je Cho, Jong-Min Kim, M. G. Choi, Y. T. Kim and Young-Eui Shin,

Reliability evaluation of QFP solder joint using Sn-8Zn-3Bi solder paste during the thermal shock test,

Materials Science Forum, V.580-582, pp.247-250, June 2008

Jong-Min Kim, K. C. Yang, S. B. Lee, Seong Hyuk Lee, Young-Eui Shin, Kyong Ho Chang, J. G Han, Yong-Sung Eom, Jong-Tae Moon, Ji-Won Baek and Jae Do Nam,

An investigation on wetting characteristics of solder particle for solderable electrically conductive adhesives (ECAs),

Materials Science Forum, V.580-582, pp.217-220, June 2008

Seong Hyuk Lee, Jung Hee Lee, Jin Woon Lee and Jong-Min Kim,

Coalescence characteristics of fusible particles in solderable isotropic conductive adhesives (ICAs),

Materials Science Forum, V.580-582, pp.213-216, June 2008 (Corresponding Author)

Hyung Sub Sim, Kwan Gu Kang, Seong Hyuk Lee, Jong-Min Kim and Young-Eui Shin,

A numerical study on nonequilibium heat transfer and crater formation in thin metal films irradiated by femtosecond pulse laser,

Materials Science Forum, V.580-582, pp.143-146, June 2008

Yong-Sung Eom, Ji-Won Baek, Jong-Tae Moon, Jae-Do Nam and Jong-Min Kim,

Characterization of polymer matrix and low melting point solder for anisotropic conductive film,

Microelectronic Engineering, V.85, N.2, pp.327-331, Feb. 2008

Kyong-Ho Chang, Gab-Chul Jang, Young-Eui Shin, Jung-Guen Han and Jong-Min Kim,

The behavior of welded joint in steel pipe members under monotonic and cyclic loading,

Int. J. Pressure Vessels and Piping, V.83, pp.846-852, Nov. 2006

Seong Hyuk Lee, Hyung Sub Sim, Junghee Lee, Jong-Min Kim and Young-Eui Shin,

Three temperature model for nonequilibirum transfer in semiconductor films irradiated with short pulse lasers,

Materials Transactions, V.47, N.11, pp.2835-2841, Nov. 2006

Seungmock Lee, Jong-Min Kim and Young-Eui Shin,

The influences of residual stress on the frequency of ultrasonic transducers with composite membrane structure,

Journal of Mechanical Science and Technology, V.20, N.1, pp.76-84. Jan. 2006

Young-Eui Shin, Yeon Sung Kim, Hyoung-Il Kim, Jong-Min Kim, Kyong Ho Chang and Dave F. Farson,

Selection of proper fatigue model for flip chip package reliability,

Materials Science Forum, V.502, pp.393-398, Dec. 2005

Jong-Min Kim, Kiyokazu Yasuda and Kozo Fujimoto,

Novel interconnection method using electrically conductive paste with fusible filler,

Journal of Electronic Materials, V.34, N.5, pp.600-604, May 2005

Seungmock Lee, Tsunehisa Tanaka, Koji Inoue, Jong-Min Kim, Young-Eui Shin and Masanori Okuyama,

Stress influences on the ultrasonic transducers,

Sensors and Actuators, A; Physical, V. 119, pp.405-411, Apr. 2005

Kiyokazu Yasuda, Jong-Min Kim and Kozo Fujimoto,

Adhesive joining process and joint property with low melting point filler,

Journal of Electronic Packaging, V.127, N.1, pp.12-17, Mar. 2005 (Corresponding Author)

Jong-Min Kim, Kiyokazu Yasuda and Kozo Fujimoto,

Resin self-alignment processes for self-assembly systems,

Journal of Electronic Packaging, V.127, N.1, pp.18-24, Mar. 2005

K. S. Kim, K. W. Ryu, C. H. Yu and Jong-Min Kim,

The formation and growth of intermetallic compounds and shear strength at Sn-Zn solder/Au-Ni-Cu interfaces,

Microelectronics Reliability, V.45 ,N.3-4, pp.647-655, Mar.-Apr. 2005

Jong-Min Kim, Kiyokazu Yasuda and Kozo Fujimoto,

Isotropic conductive adhesives with fusible filler particles,

Journal of Electronic Materials, V.33, N.11, pp.1331-1337, Nov. 2004

Keun-Soo Kim, Katsuaki Suganuma, Jong-Min Kim and Chi-Won Hwang,

The observation and simulation of Sn-Ag-Cu solidification in chip-scale packaging,

JOM, V.56, N.6, pp.39-44, June 2004

Jong-Min Kim, Young-Eui Shin and Kozo Fujimoto,

Dynamic modeling for resin self-alignment mechanism,

Microelectronics Reliability, V.44, N.6, pp.983-992, June 2004

Kiyokazu Yasuda, Jong-Min Kim, Masahiro Yasuda and Kozo Fujimoto,

New process of self-organized interconnection in packaging using conductive adhesive with low melting point filler,

Japanese Journal of Applied Physics, V.43, N.4B, pp.2277-2282, Apr. 2004 (Corresponding Author)

Kiyokazu Yasuda, Jong-Min Kim, Masahiro Yasuda and Kozo Fujimoto,

Formation of a self-interconnected joint using a low-melting-point alloy adhesive,

Materials Transactions, V.45, N.3, pp.799-805, Mar. 2004 (Corresponding Author)

Jong-Min Kim, Kiyokazu Yasuda, Masahiro Yasuda and Kozo Fujimoto,

The effect of reduction capability of resin material on the solder wettability for electrically conductive adhesives (ECAs) Assembly,

Materials Transactions, V.45, N.3, pp.793-798, Mar. 2004

Jong-Min Kim, Kiyokazu Yasuda, Masahiro Rito and Kozo Fujimoto,

New electrically conductive adhesives filled with low melting point alloy fillers,

Materials Transactions, V.45, N.1, pp.157-160, Jan. 2004

Jong-Min Kim and Kozo Fujimoto,

Parametric design for resin self-alignment capability,

IEICE Transaction on Electronics, V.E86-C, N.10, pp.2129-2136, Oct. 2003

Jong-Min Kim, D. F. Farson and Young-Eui Shin,

Improvement of board level reliability for μBGA solder joints using underfill,

Materials Transactions, V.44, N.10, pp.2175-2179, Oct. 2003

Jong-Min Kim, Young-Eui Shin and Kozo Fujimoto,

Effect of viscosity of liquid resin on resin self-alignment capability,

Materials Science Forum, V.439, pp.12-17, Jun. 2003

Jong-Min Kim, Kiyokazu Yasuda, Kozo Fujimoto and Shuji Nakata,

Highly precise positioning method by pull-up model self-alignment process using liquid surface tension,

Quarterly Journal of the JWS, V.20, N.3, pp.346-354, Aug. 2002

3-D highly precise self-alignment process using surface tension of liquid resin material,

IEICE Transaction on Electronics, V.E85-C, N.7, pp.1491-1498, Jul. 2002